Xov xwm

Kev Ntsuam Xyuas Ntawm Chav Turbine Hniav Manufacturing Process

Oct 10, 2025 Tso lus

1. Kev xaiv khoom thiab Melting

High-Tub kub Alloys: Nickel-raws li / cobalt-raws li alloys (xws li Inconel 718) yog lub hauv paus ntsiab lus, yuav tsum tau ntxiv cov ntsiab lus xws li Al thiab Ti los ua 'theem zog.

Directional Solidification/Single Crystal Technology: Kem lossis ib zaug -cov qauv siv lead ua tau txais los ntawm kev tswj cov cua txias, tshem tawm cov kab hla hla ciam teb thiab txhim kho siab -kub creep resistance.

Purity Control: Ob txheej txheem ntawm lub tshuab nqus tsev induction melting (VIM) + electroslag remelting (ESR) yog siv los tswj cov ntsiab lus impurity ntawm qib ppm.

 

2. Precision Casting

Ceramic Plhaub Txheej Txheem:

Ciab Txhaj Moulding: Kev kam rau siab tswj tsis pub dhau ± 0.1mm

Multi- Txheej Ceramic Txheej: Silica sol bonding ntawm alumina / zirconia, ua raws li siab -kub sintering los ua lub plhaub hollow.

Pouring Parameters: Ultra- kub casting siab tshaj 1600 degree, ua ke nrog electromagnetic teb tiv thaiv ntawm turbulence kom txo porosity tsis xws luag.

 

3. Machining

Tsib -Axis Milling:

Siv pob zeb diamond-coated cov cuab yeej, spindle ceev tshaj 30,000 rpm

Hniav profile yuam kev <0.05mm, nto roughness Ra 0.4μm

Electrochemical Machining (ECM):

Rau qhov nyuaj-rau- cov khoom siv tshuab, tsim los ntawm anodic dissolution, tsis muaj kev ntxhov siab

Qhov tseeb mus txog ± 0.03mm, haum rau txoj hauv kev txias txias

 

4. Kev tsim khoom cua txias

Zaj duab xis Hole Machining:

Laser Drilling (nanosecond / picosecond laser): Qhov txoj kab uas hla 0.3-1.2mm, qaij lub kaum sab xis 20℃-90 degree

Electrical Discharge Machining (EDM): Siv rau machining irregularly zoo li lub qhov, tsis txhob recast txheej.

Internal Cavity Structure:

3D Printing (SLM): ncaj qha ua raws li cov cua txias

Diffusion Vuam: Multi- txheej ultra-thin phaj stacking vuam, channel qhov siab 0.5-2mm

 

5. Nto Strengthening Technologies
Thermal Barrier Coatings (TBCs):

Dual{0}} txheej txheej: MCrAlY binder txheej (100-150μm) + Yttrium-stabilized zirconia (YSZ, 200-300μm)

Action plasma spraying (APS) lossis electron beam lub cev vapor deposition (EB-PVD)

Laser shock peening (LSP):

Lub zog ceev ntawm GW / cm² theem, inducing residual compressive kev nyuaj siab qhov tob txog li 1-2 hli

Lub neej qaug zog nce 3-5 zaug

Xa kev nug